Datacon 8800 fc quantum

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August undefined, 2024

WebThe Datacon 8800 CHAMEO advanced bonder raises a field proven platform concept to an advanced level. It is the perfect fit for chip attach of any WL-FOP process, supporting both face-down (flip mode) and face-up (non flip mode) package designs. WebDATACON / BESI: 8800 FC Quantum #9277620. BONDERS Bonder (2) Mounting arms Up to 7,000 UPH Power supply: 3x400 V, 10.8 A, 7.6 kVA 2005 vintage. More Details and …

DATACON 8800 - Tarasemi

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Datacon-8800 FC Quantum–48519 Bridge Tronic Global

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Datacon 8800 fc quantum

Flip-chip die bonder Esec 2100 FC hS - DirectIndustry

WebThe Datacon 8800 flip chip platform provides all features needed to cope with the challenges of today’s flip chip production and the demands of tomorrow, while at the … WebBONDING FLIP CHIP DATACON BESI +353 (0) 49 854 0747 +353 (0) 87 192 1110. [email protected]. Home; Buy Equipment ; About Us; Send Request; We Need To …

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WebAddress. Suite 410, Korea Business Center B/D 309, Gangnam-daero, Seocho-gu, Seoul, South Korea E-mail. [email protected]. Tel. +82-2-582-6900 Fax. WebDatacon 8800 FC QUANTUM advanced 1 / 2 Pages Catalog excerpts Datacon 8800 FC QUANTUM As Mass Reflow Flip Chip becomes dominant in IC packaging, we do set a …

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WebDatacon 8800 FC QUANTUMhS Datacon 8800 TC advanced Datacon 8800 FC QUANTUM advanced Datacon 8800 CHAMEO advanced Esec 2100 FC hS Packaging … WebMar 22, 2016 · For the 8800 FC QUANTUM Datacon decided to arrange the substrate indexer like a bridge over the wafer table. In a parallel process the two flippers bring up the die from the wafer next to...

WebModel 8800 FC QUANTUM Category Die Sorters and Attachers Serial Number - Vintage - Wafer Size - Condition - Other Information Configuration - Description - Listings …

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